ASE Technology (ASX) Lowered by CLSA

ASE Technology (ASX) Lowered by CLSA

ASE Technology (NYSE:ASX) was downgraded by research analysts at CLSA from an “outperform” rating to an “underperform” rating in a report issued on Monday, The Fly reports.

Separately, ValuEngine lowered shares of ASE Technology from a “hold” rating to a “sell” rating in a research note on Saturday.

NYSE ASX opened at $4.39 on Monday. The company has a quick ratio of 0.88, a current ratio of 1.11 and a debt-to-equity ratio of 0.63. ASE Technology has a one year low of $4.37 and a one year high of $8.00. The company has a market capitalization of $10.55 billion, a PE ratio of 12.91 and a beta of 0.77.

ASE Technology (NYSE:ASX) last posted its quarterly earnings data on Friday, July 27th. The semiconductor company reported $0.18 EPS for the quarter. ASE Technology had a net margin of 8.50% and a return on equity of 12.63%. The business had revenue of $2.84 billion during the quarter.

Institutional investors have recently modified their holdings of the stock. US Bancorp DE purchased a new position in ASE Technology in the second quarter worth approximately $107,000. Cubist Systematic Strategies LLC purchased a new position in ASE Technology in the second quarter worth approximately $110,000. Signaturefd LLC purchased a new position in ASE Technology in the second quarter worth approximately $119,000. PNC Financial Services Group Inc. purchased a new position in ASE Technology in the second quarter worth approximately $136,000. Finally, Capital Fund Management S.A. purchased a new position in ASE Technology in the second quarter worth approximately $143,000. Institutional investors own 5.45% of the company’s stock.

About ASE Technology

ASE Technology Holding Co, Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services (EMS) in the United States, Taiwan, Asia, Europe, and internationally. The company offers packaging services, including flip-chip ball grid array (BGA), flip-chip chip scale package (fcCSP), advanced chip scale packages (aCSP), quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, high-band package on package, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions, as well as module-based solutions.

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